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Professional TSMC R&D Director Signs up with Samsung’s Chip Product packaging Group

An upper-level R&D exec with virtually 20 years of experience at TSMC just recently occupied a setting with Samsung. Semiconductor sector experts talking to Taiwan’s DigiTimes defined the elderly exec’s step as “uncommon” as well as one that might be a “risk” to TSMC’s hegemony.

Lin Jun-Cheng began his lengthy period at TSMC in 1999 after offering at Micron Innovation. The officer operated in TSMC’s innovative product packaging as well as screening division as well as has actually been called a driving pressure in progressing product packaging modern technologies like CoWoS as well as details. Prior to leaving TSMC in 2017, Lin was the Replacement Supervisor of the R&D division. During, he functioned as the chief executive officer of Skytech, a semiconductor tools business in Taiwan, gathering manufacturing experience for product packaging tools. His brand-new setting at Samsung is as the VP of Advanced Product Packaging Service.

( Picture credit rating: TSMC)

Records recommend Lin’s time at TSMC really did not offer the possibility to deal with customers straight. Possibly he obtained far more of that sort of experience in his newest stewardship of Skytech. However, his TSMC operate in 3D IC product packaging was extremely preferred with vital factory customers like Nvidia, Apple, AMD, as well as different HPC expert business. Additionally, throughout his TSMC R&D profession, Lin assisted the company protect greater than 400 licenses.

( Picture credit rating: TSMC)

It deserves looking a lot more very closely at Lin’s newest experiences at Skytech. The business in fact makes factory devices for sustaining 2.5 D as well as 3D product packaging. Lin has actually assisted Skytech protected over 100 licenses.


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